The OKS 1103 from REIKA-WE is a high-quality thermal paste designed for efficient heat dissipation from electronic components. With the article number 118582-13, reliable performance for professional applications is ensured. This paste is characterized by its good thermal conductivity values, making it ideal for use between heat sinks and heat sources such as CPUs, GPUs, or power electronics. The easy application and good dispersibility ensure uniform heat transfer. Areas of application include servers, graphics cards, power electronics, and general industrial heat sink solutions. Order OKS 1103 now for optimized thermal management.
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